Introduction of Wafer Surface Grinding Machine Model . - Komatsusurface grinding machine has been developed and introduced into the . technologies used in the grinding machine are described and the product profile is.backgrinding machine sorece,Semiconductor Back-Grinding - IDC-OnlineSemiconductor Back-Grinding. The silicon wafer on which . In a practical machine, water is used to cool the wafer, and the thickness reduction is accomplished.